SSOP30

In developing your designs, please ensure the datasheet.

SSOP30package
Toshiba Code P-SSOP30-1120-1.00-001
Mounting Surface Mount
Pins 30
Width×Length×Height
(mm)
20.0×14.2×2.2
Land pattern(2D Model)
3D Model STEP
Package Dimensions (mm)
Packing Method -

Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3.

  • 3D model(.stp): 3D model Data in STEP Format
  • Land Pattern(.dxf): Land pattern Data in DXF Format
  • Land Pattern(.xml):Land pattern Data in JEITA LPB C-format
  • Land Pattern(.dra):Land pattern Data for Cadence®OrCAD®
  • Land Pattern(.ftp): Land pattern Data for Zuken®CR-5000/CR-8000
Jump to Package & Packing Information
在新窗口打开
Not Found | TOSHIBA Semiconductor & Storage Products

Not Found
Sorry, the page you are looking for has not been found.
誠に申し訳ございません。ご指定いただいたページが見つかりません。
抱歉,未找到您要找的网页。


Please check the URL again or select your area from below, then go to the top page.

URLをご確認の上再度お試しいただくか、以下より目的の地域を選択いただき、トップページに移動してください。
感谢您访问我们的网站。请尝试再次检查一下网址或选择以下您所在的区域,返回至东芝存储&电子元器件解决方案公司网站的首页。